Method of densifying thin porous substrates by chemical vapor infiltration, and a loading device for such substrates

ABSTRACT

To densify thin porous substrates ( 1 ) by chemical vapor infiltration, the invention proposes using loading tooling ( 10 ) comprising a tubular duct ( 10 ) disposed between first and second plates ( 12, 13 ) and around which the thin substrates for densification are disposed radially. The tooling as loaded in this way is then placed inside a reaction chamber ( 20 ) in an infiltration oven having a reactive gas admission inlet ( 21 ) connected to the tubular duct ( 11 ) to enable a reactive gas to be admitted into the duct which distributes the gas along the main faces on the substrates ( 1 ) in a flow direction that is essentially radial. The reactive gas can also flow in the opposite direction, i.e. it can be admitted into the tooling ( 10 ) from its outer envelope ( 16 ) and can be removed via the duct ( 11 ).

This application is a §371 national phase filing of PCT/FR2006/050141filed Feb. 16, 2006, and claims priority to French application No. 0501615 filed Feb. 17, 2005.

BACKGROUND OF THE INVENTION

The present invention relates to the techniques of chemical vaporinfiltration that are used in particular when making parts out ofthermostructural composite material. The invention relates moreparticularly to densifying thin porous substrates by deposing a matrix,i.e. densifying substrates that present thicknesses that are relativelysmall compared with their main dimensions.

In order to fabricate parts out of composite material, in particularparts made out of thermostructural composite material constituted by arefractory fiber preform (e.g. made of carbon or ceramic fibers) that isdensified by a refractory matrix (e.g. of carbon or ceramic), it iscommon practice to make use of chemical vapor infiltration methods.Examples of such parts are thruster nozzles made of carbon-carbon (C—C)composite, or brake disks, in particular for airplane brakes, likewisemade of C-C composite.

Densifying porous substrates by chemical vapor infiltration consists inplacing the substrates in a reaction chamber of an infiltrationinstallation by using support tooling, and in admitting a reactive gasinto the chamber, which gas contains one or more precursors of thematerial that is to be deposited within the substrates in order todensify them. Infiltration conditions, in particular the composition andthe flow rate of the reactive gas, and also the temperature and thepressure within the chamber, are selected to enable the gas to diffusewithin the accessible internal pores of the substrates so as to depositthe desired material therein by decomposing a constituent of the gas orby a reaction between a plurality of the constituents thereof. Thereactive gas is usually preheated by being passed through a preheaterzone situated in the reaction chamber and into which the reactive gasinlet opens out. That method corresponds to the free-flow chemical vaporinfiltration method.

In an industrial installation for chemical vapor infiltration, it iscommon practice to load the reaction chamber with a plurality ofsubstrates or preforms that are to be densified simultaneously so as toincrease the yield of the densification method, and consequentlyincrease the packing density with which reaction chambers are loaded.Nevertheless, using free-flow chemical vapor infiltration to densify aplurality of substrates in a common chamber leads to certaindifficulties, in particular relating to the uniformity of the resultingdensification. When densifying thin substrates, e.g. in the form of finerectangular plates disposed longitudinally in a reaction chamber with areactive gas being diffused in free flow from the top edge thereof, ithas been found that densification gradients are present within thesubstrates and between substrates within a single chamber (dispersion),and that this arises in spite of the care with which infiltrationconditions are controlled. These deposition gradients are due inparticular to lack of control over the flow of reactive gas within thechamber (privileged flow paths appear), thus leading to prematuredepletion of reagents and consequently to dispersions in densificationbetween those portions of the substrates that are closest to and thosethat are furthest from the gas admission points.

In addition to the observed lack of uniformity in deposition, thedensification of thin substrates presently also requires the use ofsupport tooling so as to limit the extent to which the parts deform as aresult of the deposition gradient and/or of internal stresses in thematerial. The use of such tooling penalizes the density with which thechamber can be loaded.

Procedures and installations for densifying porous annular substrates bychemical vapor infiltration are described in particular in documents US2004/237898 and U.S. Pat. No. 5,904,957. Nevertheless, those methodsapply essentially to densifying substrates of annular shape disposed instacks, and they are not adapted to densifying substrates presentingthin shapes.

OBJECT AND SUMMARY OF THE INVENTION

An object of the invention is to provide a method that enables thinporous substrates to be densified, i.e. substrates that presentthickness that is small relative to the dimensions of their main faces,such as fine parts that are plane or curved, and to enable thesubstrates to be loaded at high density, while simultaneously reducingdensification gradients in the substrates.

This object is achieved by a chemical vapor infiltration method fordensifying thin porous substrates with a material that is depositedtherein, the method comprising: loading substrates for densificationinside a reaction chamber of an infiltration oven; admitting close to afirst longitudinal end of the reaction chamber a reactive gas containingat least one precursor of the material to be deposited; and removing theresidual gas through an outlet situated close to the longitudinal end ofthe reaction chamber opposite its first end,

in which method, in accordance with the invention, the substrates aredisposed radially around a longitudinal duct, the reactive gas thenbeing distributed along the main faces of the substrates in a flowdirection that is essentially radial.

Thus, the flow direction of the reactive gas along the substrates iscontrolled, and consequently so is the uniformity with which thesubstrates are densified. The distribution of the reactive gas takesplace as close as possible to the faces of the substrates, thus makingit possible to reduce local depletion in reactive gas of the kind thatis observed when the substrates are close to one another and the flow isnot directed. The amount of reactive species diffusing within thesubstrates is greater.

Consequently, the method of the invention makes it possible to densifythin porous substrates, while simultaneously increasing the quality ofthe parts obtained and the volume of the reaction chamber that can beloaded.

In addition, the reactive gas can be preheated prior to beingdistributed along the substrates. In this way, the preheater zonegenerally used in reaction chambers with free-flow methods is no longernecessary, thus making it possible to further increase the volume of thechamber that can be loaded.

The reactive gas can be distributed from the duct, i.e. close to theinside edges of the substrates, and it can be removed from close to theoutside edges of the substrates. Conversely, the reactive gas admittedinto the chamber can be distributed from the outside edges of thesubstrates and can be removed from the inside of the longitudinal duct.Either way, the gas flows along the main faces of the substrates in aflow direction that is essentially radial.

When the reactive gas is distributed from the duct, the radialconfiguration of the substrates provides a local distribution ofsubstrates that matches the depletion of the gas as it flows along thefaces thereof. On leaving the duct, the gas presents its richestcomposition, and it is then in the zone where the substrates are loadedwith the greatest packing density. Thereafter the gas becomes depletedas it travels along the faces of the substrates that spread outprogressively relative to one another, thereby reducing the localpacking density. This mutual compensation can be useful when thereactive gas presents a starting composition that is already low inreactive species.

Wedge-shaped inserts may be disposed between pairs of adjacentsubstrates so as to encourage the reactive gas to flow as close aspossible to the faces of the substrates.

As a function of the internal dimensions of the reaction chamber, it ispossible to superpose and/or juxtapose a plurality of series ofsubstrates in the internal volume of the chamber. In each stack, thelongitudinal ducts communicate with one another to form a single channelfor distributing or removing the reactive gas.

With substrates of small dimensions, one or more additional rows ofsubstrates can be juxtaposed, each substrate of the additional row thenlying in the same radial plane as the substrate of the adjacent row soas to avoid disturbing the radial flow of the reactive gas.

The invention also seeks to provide loading tooling that enables theabove-defined method to be implemented.

This object is achieved by a loading device comprising a tubular ductdisposed between first and second plates, the tubular duct opening outin the surface of at least one of the plates in order to enable areactive gas to be admitted to or removed from said duct, each plateincluding means for holding the substrates in a radial position aroundsaid duct, the tubular duct having a plurality of orifices fordistributing or removing the reactive gas along the main faces of thesubstrates in a flow direction that is essentially radial.

Once placed in a reaction chamber, the device acts as a mini-reactor inwhich the flow of gas is controlled as described above. With thisdevice, the load of substrates can be prepared in advance away from thedensification installation, and is easily transported without risk tothe reaction chamber. Thus, the time required for loading/unloadingreaction chambers is reduced.

The orifices of the tubular duct are preferably disposed so as todistribute or remove the reactive gas as close as possible to the facesof the substrates.

According to an aspect of the invention, the device further comprises anouter cylindrical envelope surrounding the substrates and disposedconcentrically about the tubular duct, the envelope including aplurality of orifices for removing or distributing the reactive gas. Theorifices of the cylindrical envelope are preferably disposed as close aspossible to the outer edges of the substrates in order to encourage thereactive gas to flow as close as possible to the faces of thesubstrates.

Each of the first and second plates includes means for holding thesubstrates radially in position around the tubular duct. These means maybe constituted in particular by slideways or by rings provided withnotches in which the substrates are engaged.

The invention also seeks to provide an installation enabling thin poroussubstrates to be densified uniformly by chemical vapor infiltration, andto do so with a high loading capacity.

This object is achieved by an installation comprising a reaction chamberwithin which there is a zone for loading substrates for densification, asusceptor defining the chamber and associated with heater means, anadmission inlet for reactive gas at a first longitudinal end of thechamber, and a removal outlet situated close to the longitudinal end ofthe reaction chamber opposite from its first end,

the installation being characterized in that the chamber comprises aplurality of thin porous substrates disposed in at least one loadingdevice as described above, the tubular duct of the device beingconnected to the admission inlet or to the removal outlet for reactivegas of the chamber.

Depending on its dimensions, the chamber may comprise a plurality ofloading devices stacked one on another, the tubular duct of one loadingdevice co-operating with the tubular duct of the device on which it isstacked, and the tubular duct of the loading device situated at the topof the stack being connected to the reactive gas admission inlet orremoval outlet of the chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

Other characteristics and advantages of the invention appear from thefollowing description of particular embodiments of the invention givenas non-limiting examples, with reference to the accompanying drawings,in which:

FIGS. 1A to 1C are perspective views of tooling used for loading anddensifying thin porous substrates in accordance with the invention;

FIG. 2 is a perspective view of a portion of the FIG. 1A tooling showinga variant embodiment of the means for holding and positioningsubstrates;

FIG. 3 is a diagrammatic section view showing an installation fordensification by chemical vapor infiltration in which the substrates areloaded by means of tooling of the invention;

FIG. 4A is a section view of the FIG. 3 installation;

FIG. 4B is a detail view of a portion of FIG. 4A;

FIG. 4C shows the flow of reactive gas in the presence of inserts;

FIG. 5 is a diagrammatic section view showing an installation fordensification by chemical vapor infiltration in which the flow of thereactive gas is reversed relative to the installation of FIG. 3;

FIG. 6 is a diagrammatic section view showing an installation fordensification by chemical vapor infiltration in which a plurality oftooling devices of the invention are superposed and juxtaposed;

FIG. 7 is a section view of the FIG. 6 installation; and

FIGS. 8A and 8B show respectively the results obtained with a method ofdensification by chemical vapor infiltration using a free flow and usinga method of densification by chemical vapor infiltration in accordancewith the invention.

DETAILED DESCRIPTION OF AN IMPLEMENTATION

The chemical vapor infiltration method for densifying thin poroussubstrates in accordance with the invention makes use of specifictooling for loading purposes that are constructed and assembled asdescribed below with reference to FIGS. 1A to 1C.

FIG. 1A shows a loading device or tool 10 at the beginning of theoperation of loading substrates 1 that are to be densified, i.e. beforethe tooling is closed and inserted in a reaction chamber of anindustrial chemical vapor infiltration installation. The tooling 10comprises a vertical tubular duct 11 disposed between two circularplates 12 and 13. The top end of the duct 11 co-operates with a centralopening 121 formed through the plate 12, and the bottom end of the duct11 is closed by the plate 13. In a variant, the bottom end of the duct11 could co-operate with a central opening formed through the plate 13,in particular to enable tooling devices to be superposed in a reactionchamber, as explained below.

The facing side faces of the plates 12 and 13 have respective holdingand positioning means that are to receive the substrates fordensification. In this embodiment, shown in FIG. 1A, the plates 12 and13 have respective pluralities of slideways 14 and 15 that are uniformlydistributed radially around the duct 11. The substrates 1 for densifyingare loaded one by one into the tooling, by engaging them in theslideways. Other devices can be used for holding the substrates inposition. For example, as shown in FIG. 2, the slideways may be replacedby rings 15′, 15″ having notches in which the substrates are engaged. Inanother variant, the plates may be provided with riders optionally ofdifferent dimensions or adjustable in height for receiving substrates ofdifferent sizes. These devices may be fitted onto the plates or they mayform integral portions thereof (bulk machining).

FIG. 1B shows the tooling 10 when all of the substrates 1 have beenloaded. It can be seen that they are uniformly distributed radiallyaround the duct 11. Once fully loaded, the tooling 10 is closed by acylindrical envelope 16 as shown in FIG. 1C. The tooling 10 then forms acell that protects the substrates. The substrates can thus betransported easily to the reaction chamber. All of the elements of thetooling 10 (plates, tubular duct, substrate holder means, cylindricalenvelope, . . . ) are made for example of graphite, of expandedgraphite, or of C/C composite material.

Optionally, wedge-shaped inserts 30 can be disposed between pairs ofadjacent substrates so as to encourage the reactive gas to flow as closeas possible to the faces of the substrates. Like the other elements ofthe tooling 10, the inserts 30 may be made for example out of graphite,of expanded graphite, or of a C/C composite material.

The duct 11 for delivering or removing the reactive gas as explainedbelow has a plurality of orifices 111 for allowing the gas to passthrough. These orifices 111 are preferably disposed in lines parallel tothe axis of the tube, which lines are uniformly spaced apart from oneanother around the periphery of the duct, and the orifices on a givenline are at constant spacing.

The cylindrical envelope 16 is also provided with orifices 161 to allowthe gas to be removed from or delivered into the tooling and also toallow gas to flow within the reaction chamber. The number and angularpositioning of the orifices 161 through the envelope 16 are preferablyselected so as to be in alignment one to one with the orifices 111 inthe duct 11.

The tubular duct 11 and the cylindrical envelope 16 may be made up of aplurality of sections connected end to end to provide a modularconstruction.

FIG. 3 is a diagram showing a reaction chamber 20 of an installation oroven for chemical vapor infiltration having substrates for densifyingshown loaded therein. The chamber 20 is generally cylindrical in shape.

In order to densify the substrates 1, a reactive gas containing one ormore precursors of the material of the matrix for deposition isintroduced into the chamber 20. With carbon, for example, hydrocarbongases are used, typically propane, methane, or a mixture of both. With aceramic material, such as silicon carbide (SiC) for example, it ispossible in well-known manner to use methyltricholorosilane (MTS) as aprecursor for SiC.

In well-known manner, the porous substrates 1 are densified bydepositing within them the matrix material as produced by decompositionof the precursor contained in the reactive gas diffusing inside theaccessible internal pores of the substrates. The pressure andtemperature conditions needed to deposit various matrices by chemicalvapor infiltration are themselves well known.

In the example shown, the reactive gas is brought in by a pipe 21 thatopens out into the top portion of the chamber. The residual gas isextracted from the bottom portion of the chamber via a pipe 22.

Heating inside the chamber is produced by a graphite susceptor 23 thatis electromagnetically coupled with an induction coil (not shown). Thesusceptor 23 defines the inside volume 24 of the vertical axis chamberwith the pipe 21 passing through the cover 20 a and the pipe 22 passingthrough the bottom 20 b. The bottom and the cover are likewise made ofgraphite.

In order to densify thin porous substrates using a method in accordancewith the invention, the substrates are loaded into the inside of thechamber 20 using the loading tooling 10 as described above. As shown inFIGS. 3 and 4A, the axis of the duct 11 coincides with the axis of thechamber so that the substrates 1 are disposed longitudinally along saidaxis and extend radially around it starting from the outside wall of theduct 11. The substrates are contained in an internal volume 17 definedbetween the duct 11, the envelope 16, and the plates 12 and 13, thisvolume defining the reaction zone for densifying the substrates.

The pipe 21 of the chamber is connected to the duct 11 of the tooling,which forms a preheating zone for the reactive gas prior to beingdistributed towards the substrates 1. A sleeve 18 for forming apreheater chamber may also be disposed on the top portion of the plate12 around the opening 121. The preheated reactive gas is distributed inthe internal volume 17 by passing through the orifices 111 in the duct11 and passes through this internal volume 24 of the chamber bydiffusing through the substrates 1 and passing through the orifices 161of the envelope 16. The residual gas is extracted from the bottom 20B ofthe chamber through the pipe 22 which is connected to suction means (notshown).

Distributing the reactive gas by passing it through the orifices 111 ofthe duct 11 serves to ensure that the gas flows essentially radially inthe reaction zone. By controlling the flow direction of the gas in thisway relative to the shape of the substrates, it is possible to ensurethat the gas becomes depleted in substantially uniform manner over theentire width of the substrates.

In addition, the loading tooling enables the reactive gas to be conveyedas close as possible to the substrates. As shown in FIGS. 4A and 4B, thereactive gas is distributed from the duct 11, passing through theorifices 111 that face or are close to the inside edges of thesubstrates. Similarly, the orifices 161 in the envelope 16 through whichthe gas is removed from the reactive zone are situated facing or closeto the outside edges of the substrates. In this way, the flow ofreactive gas takes place mainly along the walls of the substrates, thusserving to optimize the quantity of reactive species that are diffusedwithin the substrates and serving to reduce the diffusion boundarylayer. A pressure gradient may optionally be maintained between the duct11 and the internal volume 17. Furthermore, head loss is controlled bythe diameter of the orifices, which diameter may vary so as to achieveequilibrium between the flows within the reaction zone, whereappropriate.

FIG. 4C shows the flow of reactive gas when the inserts 30 are placedbetween the substrates. The wedge-shape of the inserts 30 serves toreduce the volume between the substrates so as to encourage the reactivegas to flow as close as possible to the faces of the substrates.

Another advantage of the loading tooling is that it provides thepossibility of achieving a good match between the composition of thereactive gas and the local packing density of the load. When thereactive gas is introduced via the tubular duct 11, i.e. the zone inwhich the local packing density is the greatest because the substratesare arranged radially (i.e. the substrates are very close together), thegas presents a composition that is rich in reagent. Consequently, priorto being depleted, the gas is distributed in the zone having thegreatest density of substrates. Conversely, at the periphery of thetooling, the gas presents a composition that is depleted in reagent,since the reactive species have been consumed on passing through thereaction zone. This depletion is compensated by the local packingdensity being lower (the substrates diverge). This compensation isuseful when the gas presents a starting composition in reactive speciesthat is already low. The risks of premature depletion of reactivespecies from the gas can be eliminated by selecting a gas having aconcentration in reactive species that is greater than that which is tobe consumed during the infiltration process.

In a variant implementation of the method of the invention, the reactivegas can be distributed from the outside edges of the substrates andevacuated by the tubular duct 11. Under such circumstances, as shown inFIG. 5, the loading tooling 10 is disposed inside a reaction chamber 120that differs from the above-described chamber 20 in that the reactivegas is admitted into the internal volume 124 of the chamber by a pipe122 and is removed by a pipe 123 that is connected to the duct 11 of thetooling 10. In this configuration, the reactive gas admitted into thechamber by the pipe 122 flows in the internal volume 124 of the chamberand penetrates into the internal volume 17 of the tooling through theorifices 161 in the envelope 16. The gas then flows along the faces ofthe substrates in a substantially radial direction. The gas is removedfrom the volume 17 via the duct 11 by passing through its orifices 111.

Thus, with the method of densification by chemical vapor infiltration ofthe invention, better infiltration of the substrate textures is achievedin comparison with free flow methods. FIGS. 8A and 8B show respectivelythe results obtained after densification by chemical vapor infiltrationperformed with a method of densification by chemical vapor infiltrationin which the flow is free (FIG. 8A) and with a method of densificationby chemical vapor infiltration in accordance with the invention (FIG.8B). Tests were performed on identical substrates made up of wovencarbon fiber texture in the form of plane rectangular parts (230 mm×110mm) of the “nozzle flap” type, with the composition of the deposits madein the substrates being the same. The numbers given on the substrates ofFIGS. 8A and 8B represent the total thickness to the core (in μm) asmeasured at different locations on the substrates. It can be seen thatthe thickness to the core of the substrates in FIG. 8B (using the methodof the invention) is on average considerably greater than the thicknessto the core of the substrate in FIG. 8A (the free flow). Furthermore,the dispersion in densification is smaller in the substrate of FIG. 8Bthan in that of FIG. 8A.

The loading tooling behaves like a mini-reactor that enables thedensification parameters to be optimized in independent manner.Consequently, when the capacity of the reaction chamber makes thispossible, a plurality of tooling devices can be superposed and/orjuxtaposed in a single chamber. FIG. 6 shows a reaction chamber 200 inwhich a plurality of tooling devices 100 are disposed in a plurality ofstacks. In practice, the structure and the operation of the toolingdevices 100 are similar to those of the tooling 10 described above. Thedifference is that the tubular duct 110 of the tooling 100 opens out toboth sides of the tooling so that all of the ducts in a given stackco-operate from duct to duct to enable the reactive gas to bedistributed through all of the reaction zones in the tooling devices.The device at the top of each stack is connected via the top end of itsduct 110 to a pipe 210 for admitting reactive gas into the chamber. Theresidual gas is removed via the pipe 220 at the bottom of the chamber.Alternatively, as explained above with reference to FIG. 5, the flowdirection of the reactive gas may be reversed so that it flows from theoutside edges of the substrates towards their inside edges. Under suchcircumstances, the top end of the tooling duct at the top of the stackis connected to the removal pipe of the chamber.

With a multiple load made up of a plurality of tooling devices, themethod is adapted merely by feeding reactive gas to each mini-reactorthat is constituted by a tooling device. The reactive gas flow rates aremerely multiplied by the number of tooling devices that need to be fedwith gas. Furthermore, problems associated with flow in dead zones, asare encountered with free-flow methods in reaction chambers of largesize, are eliminated by using the loading tooling devices of theinvention.

The method of densification of the invention by chemical vaporinfiltration is particularly adapted to porous substrates or preformsthat are thin in shape, i.e. of thickness that is small relative totheir other dimensions (length/width of the faces). By way of example,such substrates may be parts that are rectangular or square, beingsubstantially plane or presenting curves like the substrates 101 shownin FIGS. 6 and 7 which present drop edges at their ends. Thedensification method of the invention can be used in particular forfabricating thin parts of ceramic matrix composite (CMC) material suchas nozzle flaps for aviation purposes.

The loading tooling of the invention also presents the advantage ofenabling a load to be prepared in advance, i.e. away from the premisescontaining the infiltration oven, and for the substrates fordensification to be transported to the reaction chamber with reducedrisk, unlike the standard tooling conventionally used with a free flow.The time required for loading/unloading ovens for chemical vaporinfiltration is thus reduced and handling is facilitated.

The preheating of the gas inside the duct of the tooling or in theinternal volume of the chamber between the inside wall of the chamberand the outer envelope of the tooling makes it possible to omit apreheater zone as is conventionally used with free-flow chemical vaporinfiltration methods. The working volume of the chamber is thusincreased, thereby enabling the oven to be loaded with increased packingdensity.

1. A loading device for densifying thin porous substrates by chemicalvapor infiltration in a reaction chamber of an infiltration oven, thedevice comprising: first and second plates, each of the first and thesecond plates having a side face in registration with and opposing theside face of the other plate with a space therebetween and each havingcorresponding slotted portions disposed on said side faces; a tubularduct having an axis that coincides with an axis of the reaction chamberand that is disposed between the first and second plates, the tubularduct opening out in the space between the opposing side faces in orderto enable a reactive gas to be admitted to or removed from said duct,wherein the slotted portions are structured and arranged for holding thesubstrates at points along a radial dimension outward from said tubularduct so that said substrates extend radially from the tubular duct andalong substantially the entire vertical extent of the tubular duct, andwherein the tubular duct includes a plurality of orifices fordistributing or removing the reactive gas along the main faces of thesubstrates in a flow direction that is essentially radial.
 2. A deviceaccording to claim 1, characterized in that the orifices in the tubularduct are disposed in such a manner as to distribute or remove thereactive gas along the faces of the substrates.
 3. A device according toclaim 1, characterized in that it further includes an outer cylindricalenvelope surrounding the substrates and disposed concentrically aboutthe tubular duct, the envelope including a plurality of orifices forremoving or distributing the reactive gas.
 4. A device according toclaim 3, characterized in that the orifices in the cylindrical envelopeare disposed adjacent to the outside edges of the substrates.
 5. Adevice according to claim 1, characterized in that it further includeswedge-shaped inserts disposed between the substrates.
 6. A deviceaccording to claim 1, characterized in that each of the first and secondplates has a plurality of slideways disposed radially about the tubularduct and in which the substrates are engaged.
 7. A device according toclaim 1, characterized in that each of the first and second plates hastwo concentric rings with equivalent numbers of notches radially alignedin pairs, in which the substrates are engaged.
 8. An installation fordensifying thin porous substrates by chemical vapor infiltration, theinstallation comprising a reaction chamber within which there is a zonefor loading substrates for densification, a susceptor defining thechamber and associated with heater means, an admission inlet forreactive gas at a first longitudinal end of the chamber, and a removaloutlet situated close to the longitudinal end of the reaction chamberopposite from its first end, the installation being characterized inthat the chamber comprises a plurality of thin porous substratesdisposed in at least one loading device according to claim 1, thetubular duct of the device being connected to the admission inlet or tothe removal outlet for reactive gas of the chamber.
 9. An installationaccording to claim 8, characterized in that the chamber contains aplurality of loading devices stacked one on another, the tubular duct ofone loading device co-operating with the tubular duct of the device onwhich it is stacked, and the tubular duct of the loading device situatedat the top of the stack being connected to the reactive gas admissioninlet or removal outlet of the chamber.
 10. An installation according toclaim 8, characterized in that the chamber contains a plurality ofjuxtaposed loading devices, the tubular duct of each loading devicebeing connected to a reactive gas admission inlet or removal outlet ofthe chamber.
 11. A device according to claim 2, characterized in that:it further includes an outer cylindrical envelope surrounding thesubstrates and disposed concentrically about the tubular duct, theenvelope including a plurality of orifices for removing or distributingthe reactive gas; the orifices in the cylindrical envelope are disposedadjacent to the outside edges of the substrates; it further includeswedge-shaped inserts disposed between the substrates; each of the firstand second plates has a plurality of slideways disposed radially aboutthe tubular duct and in which the substrates are engaged; each of thefirst and second plates has two concentric rings with equivalent numbersof notches radially aligned in pairs, in which the substrates areengaged.
 12. An installation for densifying thin porous substrates bychemical vapor infiltration, the installation comprising a reactionchamber within which there is a zone for loading substrates fordensification, a susceptor defining the chamber and associated withheater means, an admission inlet for reactive gas at a firstlongitudinal end of the chamber, and a removal outlet situated close tothe longitudinal end of the reaction chamber opposite from its firstend, the installation being characterized in that: the chamber comprisesa plurality of thin porous substrates disposed in at least one loadingdevice according to claim 11, the tubular duct of the device beingconnected to the admission inlet or to the removal outlet for reactivegas of the chamber; the chamber contains a plurality of loading devicesstacked one on another, the tubular duct of one loading deviceco-operating with the tubular duct of the device on which it is stacked,and the tubular duct of the loading device situated at the top of thestack being connected to the reactive gas admission inlet or removaloutlet of the chamber; the chamber contains a plurality of juxtaposedloading devices, the tubular duct of each loading device being connectedto a reactive gas admission inlet or removal outlet of the chamber.